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Plating equipment


Plating equipment for semiconductors, cup type


Reel-to-reel (R2R) plating line for connectors

Comprehensive service

We offer custom-built plating equipment and products tailored to specific customer needs.

We are a leading manufacturer of plating equipment for the electronics industry with machines in operation worldwide. We produce the following types of machinery:

• Plating equipment for semiconductors (wafers)
• Reel-to-reel plating equipment for connectors
• Spot plating equipment for lead frames
• Spot plating equipment for cut-strip lead frames

For more information please contact us:

Our plating equipment is developed and produced in Japan
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